RF and Microwave Microelectronics Packaging

Language: English

Published by Springer US Sep 2014, 2014

1489983244 / 9781489983244

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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Item description from seller

This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 304 pp. Englisch.

Seller Inventory # 9781489983244

Title
RF and Microwave Microelectronics Packaging
Author
Ken Kuang
Publisher
Springer US Sep 2014
Publication year
2014
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
1489983244
ISBN 13
9781489983244
Item weight
464 grams
Dimensions
235x155x17 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
First itemUS$ 26.71US$ 26.71
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BuchWeltWeit Ludwig Meier e.K.

Germany