This Special Issue titled "Recent Advances in Sensing Technology" in the book series of "Lecture Notes in Electrical Engineering" contains the extended version of the papers selected from those that were presented at the 3rd International Conference on Sensing Technology (ICST 2008) which was held in November 30 to December 3, 2008 at National Cheng-Kung University, Tainan, Taiwan. A total of 131 papers were presented at ICST 2008, of which 19 papers have been selected for this special issue.
This Special Issue has focussed on the recent advancements of the different aspects of sensing technology, i.e. information processing, adaptability, recalibration, data fusion, validation, high reliability and integration of novel and high performance sensors. The advancements are in the areas of magnetic, ultrasonic, vision and image sensing, wireless sensors and network, microfluidic, tactile, gyro, flow, surface acoustic wave, humidity, gas, MEMS thermal and ultra-wide band. While future interest in this field is ensured by the constant supply of emerging modalities, techniques and engineering solutions, many of the basic concepts and strategies have already matured and now offer opportunities to build upon.
This Special Issue titled "Recent Advances in Sensing Technology" in the book series of "Lecture Notes in Electrical Engineering" contains the extended version of the papers selected from those that were presented at the 3rd International Conference on Sensing Technology (ICST 2008) which was held in November 30 to December 3, 2008 at National Cheng-Kung University, Tainan, Taiwan. A total of 131 papers were presented at ICST 2008, of which 19 papers have been selected for this special issue.
This Special Issue has focussed on the recent advancements of the different aspects of sensing technology, i.e. information processing, adaptability, recalibration, data fusion, validation, high reliability and integration of novel and high performance sensors. The advancements are in the areas of magnetic, ultrasonic, vision and image sensing, wireless sensors and network, microfluidic, tactile, gyro, flow, surface acoustic wave, humidity, gas, MEMS thermal and ultra-wide band. While future interest in this field is ensured by the constant supply of emerging modalities, techniques and engineering solutions, many of the basic concepts and strategies have already matured and now offer opportunities to build upon.
