Reliability Technology for Integrated Circuit Packaging
Language: English
Published by Springer, 2026
- Hardcover
- New

Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
AbeBooks seller since November 22, 2018
Condition: New
US$ 272.65
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- Title
- Reliability Technology for Integrated Circuit Packaging
- Author
- Zhou, Bin; En, Yunfei; Chen, Si
- Publisher
- Springer
- Publication year
- 2026
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 981953884X
- ISBN 13
- 9789819538843
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
"Synopsis" may belong to another edition of this title.
From the Back Cover
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
"About the title" may belong to another edition of this title.
Books Puddle
New York, NY, U.S.A.
AbeBooks seller since November 22, 2018
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