Reliability Technology for Integrated Circuit Packaging
Language: English
Published by Springer, 2026
- Hardcover
- New
Condition: New
US$ 243.55
Quantity: 2 available
Add to basketItem description from seller
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry. Sprache: Englisch Gewicht in Gramm: 1015.
Seller Inventory # IB-459820
- Title
- Reliability Technology for Integrated Circuit Packaging
- Author
- Bin Zhou, Si Chen, Yunfei En
- Publisher
- Springer
- Publication year
- 2026
- Condition
- Neu
- Binding
- Gebundene Ausgabe
- Language
- English
- ISBN 10
- 981953884X
- ISBN 13
- 9789819538843
- Item weight
- 1,015 grams
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
"Synopsis" may belong to another edition of this title.
From the Back Cover
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
"About the title" may belong to another edition of this title.
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