Rf and Microwave Microelectronics Packaging
Language: English
Published by Springer, 2014
- Softcover
- Used
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
AbeBooks seller since January 28, 2020
Condition: Used - As new
US$ 310.45
Quantity: Over 20 available
Add to basketItem description from seller
Seller Inventory # 21988790
- Title
- Rf and Microwave Microelectronics Packaging
- Author
- Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Publisher
- Springer
- Publication year
- 2014
- Condition
- As New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 1489983244
- ISBN 13
- 9781489983244
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
"Synopsis" may belong to another edition of this title.
From the Back Cover
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:
- Presents methods and techniques used for measuring and testing of the electronic materials properties.
- Engages in an in-depth discussion of ceramic materials for RF/MW packaging.
- Offers numerical simulation methods and techniques used in analysis of electronic devices and materials.
- Discusses thermal management issues for RF/MW packaging.
- Creates a RF/Microwave Packaging Roadmap for Portable Devices.
"About the title" may belong to another edition of this title.
GreatBookPricesUK
Woodford Green, United Kingdom
AbeBooks seller since January 28, 2020
Shipping rates from United Kingdom to U.S.A.
| Item | 10 to 27 business days | 10 to 30 business days |
|---|---|---|
| First item | US$ 20.27 | US$ 20.27 |
Payment methods
Store description
Specialty
TradeBooksSeller's business information
Far Corner Europe Limited
19-20 Bourne Court, 19-20 Bourne Court
Woodford Green, United Kingdom IG8 8HD
Terms of sale
Company Name: GreatBookPricesUK
Legal Entity: Far Corner Europe Limited
Address: 19-20 Bourne Court, Southend Road, Woodford Green Essex, UK IG8 8HD
Registration #: 10691061
Authorized representative: Danielle Hainsey
Shipping terms
Our warehouses across the globe are fully operational without substantial delays. We are working hard and continue to overcome the daily challenges presented by COVID-19. There have been reports that delivery carriers are experiencing large delays resulting in longer than normal deliveries to customers. See USPS's website for further detail. We would like to apologize in advance if your item arrives later than the expected delivery due date.
Internal processing of your order will take about 1-2 business days. Please allow an additional 4-14 business days for Media Mail delivery. We have multiple ship-from locations - MD,IL,NJ,UK,IN,NV,TN & GA