The Semiconductor Manufacturing Handbook : Fabrication Processes, Equipment, Materials, Packaging, Testing, and Advanced Chip Technologies
Language: English
Published by Amazon Digital Services LLC - Kdp Jun 2026, 2026
- Softcover
- New
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
AbeBooks seller since August 14, 2006
Condition: New
US$ 69.11
Quantity: 2 available
Add to basketItem description from seller
Neuware - The semiconductor industry forms the technological foundation of modern civilization. From artificial intelligence computing platforms and advanced data centers to automotive electronics, renewable energy systems, communication networks, and intelligent consumer devices, semiconductor technology continues to drive the progress of the digital era. At the center of this transformation is the integrated circuit, where billions of transistors are manufactured with extraordinary precision at the atomic and molecular scale.Although semiconductor devices power nearly every aspect of modern life, the complex manufacturing processes behind them remain largely invisible outside advanced fabrication facilities. Within these highly controlled environments, engineers combine materials science, physics, chemistry, mechanical engineering, and advanced automation systems to transform silicon wafers into sophisticated electronic devices.The Semiconductor Manufacturing Handbook provides a comprehensive exploration of the technologies, manufacturing processes, equipment, materials, and engineering principles behind modern semiconductor fabrication. This book bridges the gap between semiconductor theory and the practical challenges encountered in high-volume industrial chip production.Rather than focusing only on technology marketing terms such as 'nanometer nodes,' this handbook examines the engineering foundations that make advanced semiconductor devices possible, including wafer preparation, lithography, deposition, etching, ion implantation, process integration, defect control, metrology, advanced packaging, and semiconductor testing.Designed for semiconductor engineers, electrical and electronics engineers, researchers, engineering students, and technology professionals, this book provides a structured understanding of how modern integrated circuits are manufactured and how emerging semiconductor technologies are shaping the future of computing, energy, transportation, and electronics.By combining fundamental concepts with industrial manufacturing practices, this handbook serves as a practical reference for understanding the complete semiconductor manufacturing journey-from raw silicon materials and wafer fabrication to advanced chip architectures and next-generation semiconductor technologies.…
Seller Inventory # 9798182112062
- Title
- The Semiconductor Manufacturing Handbook : Fabrication Processes, Equipment, Materials, Packaging, Testing, and Advanced Chip Technologies
- Author
- Prasun Barua
- Publisher
- Amazon Digital Services LLC - Kdp Jun 2026
- Publication year
- 2026
- Condition
- Neu
- Binding
- Taschenbuch
- Language
- English
- ISBN 13
- 9798182112062
- Item weight
- 608 grams
- Dimensions
- 279x216x14 mm
Although semiconductor devices power nearly every aspect of modern life, the complex manufacturing processes behind them remain largely invisible outside advanced fabrication facilities. Within these highly controlled environments, engineers combine materials science, physics, chemistry, mechanical engineering, and advanced automation systems to transform silicon wafers into sophisticated electronic devices.
The Semiconductor Manufacturing Handbook provides a comprehensive exploration of the technologies, manufacturing processes, equipment, materials, and engineering principles behind modern semiconductor fabrication. This book bridges the gap between semiconductor theory and the practical challenges encountered in high-volume industrial chip production.
Rather than focusing only on technology marketing terms such as "nanometer nodes," this handbook examines the engineering foundations that make advanced semiconductor devices possible, including wafer preparation, lithography, deposition, etching, ion implantation, process integration, defect control, metrology, advanced packaging, and semiconductor testing.
Designed for semiconductor engineers, electrical and electronics engineers, researchers, engineering students, and technology professionals, this book provides a structured understanding of how modern integrated circuits are manufactured and how emerging semiconductor technologies are shaping the future of computing, energy, transportation, and electronics.
By combining fundamental concepts with industrial manufacturing practices, this handbook serves as a practical reference for understanding the complete semiconductor manufacturing journey—from raw silicon materials and wafer fabrication to advanced chip architectures and next-generation semiconductor technologies.
"Synopsis" may belong to another edition of this title.
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| Item | 7 to 10 business days | 5 to 7 business days |
|---|---|---|
| First item | US$ 39.81 | US$ 51.18 |
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