Semiconductor Manufacturing Technology Introduction (2nd edition)(Chinese Edition)

( MEI ) XIAO HONG

ISBN 10: 7121188503 / ISBN 13: 9787121188503

Published by 电子工业出版社, 2013

About this Item

Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date: 2013 Pages: 479 Language: English Publisher: Electronic Industry Press. Introduction to semiconductor manufacturing technology (2) consists of 15 chapters. Chapter 1 Overview of the semiconductor manufacturing process; Chapter 2 introduces the basic semiconductor technology; Chapter 3 describes semiconductor devices. integrated circuit chips. as well as the early manufacturing technology; Chapter 4 describes the crystal structure. the growth of single crystal silicon wafer and silicon epitaxial technology; Chapter 5 semiconductor process heating process; Chapter 6 details the optical lithography process; Chapter 7 discusses the plasma theory; Chapter 8 discusses the ion implantation process used in the semiconductor manufacturing process; Chapter 9 details etching process; Chapter 10 describes the basic chemical vapor deposition (CVD) and the dielectric thin-film deposition process. and porous low-k dielectric deposition. the application of the air gap. atomic layer deposition (ALD) process; described in Chapter 11 of the metal gasification process; Chapter 12 discusses the chemical mechanical polishing (CMP) process; Chapter 13 process integration; Chapter 14 introduces the advanced CMOS DRAM and NAND flash process; Chapter 15 summarizes the book and the semiconductor industry future development. Contents: Chapter 1 Introduction 1.1 integrated circuit development history 1.1.1 World's first crystal 1.1.2 World's first integrated circuit chip 1.1.3 Moore's Law 1.1.4 graphics size and wafer size 1.1.5 Integrated 1.2.1 Materials 1.2.2 semiconductor process equipment 1.2.3 measurement and testing tools 1.2.4 wafer production 1.2.5 circuit design 1.2.6 light 1.2 integrated circuits. circuit development node 1.1.6 Moore's Law. or more than Moore Development Review manufacturing engraved version 1.2.7 wafer fabrication 1.3 Summary 1.4 References 1.5 Exercises Chapter 2 IC process yield 2.1 IC process Profile 2.2 integrated circuits 2.2.1 yield definition 2.2.2 yield and profit 2.2 basic structure 2.3.4 .3 defect and yield 2.3 cleanroom technology 2.3.1 cleanroom 2.3.2 pollutant control and yield 2.3.3 cleanroom clean room clean clothes to wear program 2.3.5 District the cleanroom protocol specification 2.4 IC process basic structure 2.4.1 wafer manufacturing 2.4.2 Equipment 2.4.3 Auxiliary District 2.5 grain testing integrated circuit testing and packaging 2.5.1 2.5.2 chip package 2.5. The final test 2.5.4 3D packaging technologies 2.6 integrated circuits trends 2.7 Summary 2.8 References the literature 2.9 Exercises Chapter 3. the basic concepts of the semiconductor foundation 3.1 Semiconductors 3.1.1 energy band gap 3.1.2 3.1.3 doped semiconductor crystal structure 3.1 Summary 3.2 The basic semiconductor components resistance diode. capacitance 3.2.3 3.2.2. 3.2.1 3.2.4 dual carrier transistor the 3.2.5 MOSFET3.3 integrated circuit chip 3.3 3.1.5 .4 dopant concentration and conductivity of semiconductor materials .1 memory 3.3.2 microprocessor 3.3.3 the ASIC (ASlC) 3.4 integrated circuits basic craft 3.4.1 dual carrier transistor manufacturing process 3.4.2 P-MOS technology (1960s technology) 3.4.3 N-MOS technology (1970s technology) 3.5 complementary metal oxide transistors 3.5.1 CMOS circuit 3.5.2 CMOS technology (1980s technology) 3.5.3 CMOS technology (1990s technology) 3.6 2000 after the semiconductor technology development trends 3.7 Summary 3.8 References 3.9 Exercises . Chapter 4 wafer fabrication Chapter 5 Chapter 6 heating process lithography process Chapter 7 Chapter 8 of the plasma process ion implantation process Chapter 9 etch process first Chapter 12 Chapter 11 10 Chapter chemical vapor deposition dielectric film metallization process semiconductor process integration of chemical mechanical polishing process of Chapter 13 Chapter 14 Chapter 15 of the IC process technology semiconductor techno.

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Bibliographic Details

• Title: Semiconductor Manufacturing Technology Introduction (2nd edition)(Chinese Edition)
• Publisher: ???????
• Publication Date: 2013
• Language: Chinese
• ISBN 10: 7121188503
• ISBN 13: 9787121188503
• Binding: paperback
• Condition: New

About this title

Synopsis

加微信[soweinc]每天分享好书和来自全球的书友一起学习交流.并且微信好友价格低至5折 .《半导体制造技术导论（第二版）》(Hong,Xiao（萧宏）)作者:Hong Xiao出版社:电子工业出版社装订方式:平装版次:第01版开本:16开出版时间:2013-01-01用纸:页数:480语种:中文丛书名:国外电子与通信教材系列类目:大中专教材教辅|大学教材