***INTERNATIONAL EDITION*** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments contain tracking numbers. Great professional textbook selling experience and expedite shipping service. Sewn binding. Paper over boards. 430 p. Contains: Illustrations. Audience: General/trade.

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Bibliographic Details

Title: Settlement Calculation on High-Rise Buildings: Theory and Application, Hardcover
Publisher: Springer
Publication Date: 2011
Language: English
ISBN 10: 3642155693
ISBN 13: 9783642155697
Binding: Hardcover
Edition: First edition.
Condition: New in new dust jacket.

About this title

Synopsis

"Settlement Calculation on High-Rise Buildings: Theory and Application" discusses, for the first time, the latest developments in settlement calculation theory and case studies including analysis and research results for more than thirty high-rise buildings with a height of 100m-420m. Rigorously reviewed, this book provides a number of useful methods and a unique practical perspective on settlement calculation of high-rise buildings. It covers soft soil constitutive model and computation parameters, the theory of soil stress and strain, and new methods of settlement calculation in super long pile and space-varying rigidity group piles, box(raft), pile-box(raft), diaphragm wall-pile-box(raft) and rock foundation on high-rise buildings. This book is a useful design and construction resource for scientists and engineers, as well as for professionals in structural mechanics and geotechnical engineering. Professor Xiangfu Chen is chairman of the Academic Commission of China State Construction Engineering Corporation (CSCEC), chief engineer of China Construction Beijing Design and Research Institute, and a Doctoral Tutor at Tongji University Shanghai.

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