Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3

Language: English

Published by Springer, 2025

9819672481 / 9789819672486

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The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2024), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India, during 19-20 December 2024. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today's society. Sprache: Englisch Gewicht in Gramm: 1180.

Title
Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 3
Publisher
Springer
Publication year
2025
Condition
Neu
Binding
Gebundene Ausgabe
Language
English
ISBN 10
9819672481
ISBN 13
9789819672486
Item weight
1,180 grams

Home-set

Mannheim, Germany

5-star seller

AbeBooks seller since April 13, 2026

Shipping rates from Germany to U.S.A.

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Home-set

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