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In. Seller Inventory # ria9783658410421_new
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view.
Title: Silicon Semiconductor Technology: Processing...
Publisher: Springer Vieweg
Publication Date: 2023
Binding: Soft cover
Condition: New
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. 1st Edition. Seller Inventory # 26396311101
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Seller Inventory # 401114594
Quantity: 2 available
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. Seller Inventory # 18396311095
Quantity: 4 available
Seller: preigu, Osnabrück, Germany
Taschenbuch. Condition: Neu. Silicon Semiconductor Technology | Processing and Integration of Microelectronic Devices | Ulrich Hilleringmann | Taschenbuch | xi | Englisch | 2023 | Springer Fachmedien Wiesbaden | EAN 9783658410407 | Verantwortliche Person für die EU: Springer Vieweg in Springer Science + Business Media, Abraham-Lincoln-Str. 46, 65189 Wiesbaden, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Seller Inventory # 126667411
Quantity: 5 available
Seller: Basi6 International, Irving, TX, U.S.A.
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Seller Inventory # ABEOCT25-302246
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching,doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includesmodern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view. Seller Inventory # 9783658410407
Quantity: 1 available
Seller: ALLBOOKS1, Direk, SA, Australia
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. Seller Inventory # SHAK275761
Seller: ALLBOOKS1, Direk, SA, Australia
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. Seller Inventory # SHAK16115
Seller: ALLBOOKS1, Direk, SA, Australia
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address. Seller Inventory # SHAK302246