Simulation of Semiconductor Processes and Devices 2007 : SISPAD 2007

Language: English

Published by Springer, Wien, Springer, 2007

3211728600 / 9783211728604

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Druck auf Anfrage Neuware - Printed after ordering - The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. …

Seller Inventory # 9783211728604

Title
Simulation of Semiconductor Processes and Devices 2007 : SISPAD 2007
Author
Tibor Grasser
Publisher
Springer, Wien, Springer
Publication year
2007
Condition
Neu
Binding
Buch
Language
English
ISBN 10
3211728600
ISBN 13
9783211728604
Item weight
862 grams
Dimensions
242x170x36 mm

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