Simulation of Thermoelastic Behaviour of Spacecraft Structures: Fundamentals and Recommendations (Springer Aerospace Technology)
Language: English
Published by Springer, 2021
- Hardcover
- New
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- Title
- Simulation of Thermoelastic Behaviour of Spacecraft Structures: Fundamentals and Recommendations (Springer Aerospace Technology)
- Author
- Appel, Simon; Wijker, Jaap
- Publisher
- Springer
- Publication year
- 2021
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 3030789985
- ISBN 13
- 9783030789985
- Series
- Book 40 of 63: Springer Aerospace Technology
The temperature mapping problem, typical for spacecraft thermoelastic analysis, is addressed. The principles of various temperature mapping methods are presented. The prescribed average temperature method, co-developed by the authors, is discussed in detail together with its spin-off to provide high quality conductors for thermal models.
The book concludes with the discussion of the application of uncertainty assessment methods. The thermoelastic analysis chain is computationally expensive. Therefore, the 2k+1 point estimate method of Rosenblueth is presented as an alternative for the Monte Carlo Simuation method, bringing stochastic uncertainty analysis in reach for large thermoelastic problems.
"Synopsis" may belong to another edition of this title.
About the Author
Simon Appel has 35-year experience as senior structural and thermal engineer in spacecraft engineering of which already 20 years as a consultant of ATG Europe to the European Space Agency. He has been supporting several spacecraft and technology development projects for the European Space Agency. Thermoelastic problems were a recurring topic in the career of Simon Appel. Besides his work on general spacecraft structural engineering simulations, he presented several papers on thermoelastic problems during conferences and workshops. Simon Appel is the main coordinator of the “European Working Group on Thermo Elastic” aiming to develop guidelines for the European space industry for thermoelastic verification.
"About the title" may belong to another edition of this title.
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