Solder Materials: 6 (Wspc Series In Advanced Integration And Packaging)
Language: English
Published by World Scientific Publishing Company, 2018
Series: Book 6 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
- Used

Seller: Biblios, frankfurt am main, hessen, GermanyBiblios
AbeBooks seller since September 10, 2024
Condition: Used
US$ 147.96
Quantity: 1 available
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- Title
- Solder Materials: 6 (Wspc Series In Advanced Integration And Packaging)
- Author
- Lin Kwang-Lung
- Publisher
- World Scientific Publishing Company
- Publication year
- 2018
- Condition
- Used
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 9813237600
- ISBN 13
- 9789813237605
- Series
- Book 6 of 7: WSPC Series in Advanced Integration and Packaging
This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
"Synopsis" may belong to another edition of this title.
Biblios
frankfurt am main, hessen, Germany
AbeBooks seller since September 10, 2024
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