Structural Analysis of Printed Circuit Board Systems

Peter A. Engel

ISBN 10: 0387979395 / ISBN 13: 9780387979397

Published by Springer New York Jun 1993, 1993

About this Item

This item is printed on demand - it takes 3-4 days longer - Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. 316 pp. Englisch.

Seller Inventory # 9780387979397

Bibliographic Details

• Title: Structural Analysis of Printed Circuit Board Systems
• Publisher: Springer New York Jun 1993
• Publication Date: 1993
• Language: English
• ISBN 10: 0387979395
• ISBN 13: 9780387979397
• Binding: Buch
• Condition: Neu
• Dimensions: 241W x 160H x 22D millimeters 241 millimeters width by 160 millimeters height by 22 millimeters depth
• Weight: 641 grams

About this title

Synopsis

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.