Substrate Noise Coupling in RFICs (Analog Circuits and Signal Processing)

Ahmed Helmy, Mohammed Ismail

ISBN 10: 1402081650 / ISBN 13: 9781402081651

Published by SPRINGER NATURE, 2008

About this Item

Gebraucht - Sehr gut SG - leichte Beschädigungen oder Verschmutzungen, ungelesenes Mängelexemplar, gestempelt - The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors' knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.

Seller Inventory # INF1000547085

Bibliographic Details

• Title: Substrate Noise Coupling in RFICs (Analog Circuits and Signal Processing)
• Publisher: SPRINGER NATURE
• Publication Date: 2008
• Language: English
• ISBN 10: 1402081650
• ISBN 13: 9781402081651
• Binding: Gebundene Ausgabe
• Condition: Sehr gut
• Dimensions: 245W x 166H x 14D millimeters 245 millimeters width by 166 millimeters height by 14 millimeters depth
• Weight: 338 grams

About this title

Synopsis

Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful “system on chip” ?rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ?ow is built, calibrated to silicon and used as part of the design and validation ?ows to uncover and ?x substrate coupling problems in RF ICs. The ?ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the ?oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.

About the Author

Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series