Surface Mount Technology : Principles and Practice

Ray P. Prasad

ISBN 10: 9401165343 / ISBN 13: 9789401165341

Published by Springer Netherlands, Springer Netherlands, 2012

About this Item

Druck auf Anfrage Neuware - Printed after ordering - Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.

Seller Inventory # 9789401165341

Bibliographic Details

• Title: Surface Mount Technology : Principles and Practice
• Publisher: Springer Netherlands, Springer Netherlands
• Publication Date: 2012
• Language: English
• ISBN 10: 9401165343
• ISBN 13: 9789401165341
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 229W x 152H x 35D millimeters 229 millimeters width by 152 millimeters height by 35 millimeters depth
• Weight: 912 grams

About this title

Synopsis

Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech­ nology to produce state-of-the-art miniaturized electronic products. How­ ever, in order to take advantage of this technology, a complete infrastruc­ ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor­ mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im­ plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.