THERMES 2007: Thermal Challenges in Next Generation Electronic Systems

With each new generation, electronic products have become faster and have incorporated greater functionality. Coupling this trend with shrinking device sizes leads to ever-increasing power densities. These pressures highlight thermal management as a critical consideration at all levels of the electronic product hierarchy, from the chip to the system.

Considering these critical design issues and the promises of new technology, it is imperative for the thermal community to focus on these thermal challenges to ensure the continued growth of the trillion-dollar electronics industry.

THERMES 2007 provides a unique opportunity for the community to focus on these challenges, with a heavy emphasis placed on the many possible solutions to these increased demands. This volume collects the many promising ideas presented, and covers a broad range of thermal management topics from heat pipes and microchannel coolers to nanoscale thermal transport, spanning harsh environments to microscale domains.

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