Explore the science behind reliable wire-bond electrical connections.
This comprehensive survey explains how bonds are fabricated and tested, helping engineers choose reliable methods for device packaging.
This practical reference covers both thermocompression and ultrasonic bonding, detailing bond types, surfaces, and the factors that affect bond quality. It also outlines a wide range of testing methods, from visual inspection to pull, shear, and fatigue tests, with guidance on interpreting results and improving processes. The book includes diagrams, procedures, and calculations to help practitioners evaluate bond performance and reliability.
- In-depth coverage of thermocompression and ultrasonic wire bonding techniques
- Step-by-step descriptions of bonding processes, equipment, and materials
- Detailed testing methods, criteria, and data interpretation for bond quality
- Appendices, figures, and tables that support practical engineering decisions
Ideal for engineers and technicians working in electronics packaging, fabrication, and reliability testing, this edition serves as a clear reference for evaluating and improving wire-bond performance.