Thermal and Power Management of Integrated Circuits

Language: English

Published by Springer US, Springer New York, 2010

144193832X / 9781441938329

Series: Book 2 of 34 - Integrated Circuits and Systems

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Druck auf Anfrage Neuware - Printed after ordering - In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Seller Inventory # 9781441938329

Title
Thermal and Power Management of Integrated Circuits
Author
Manoj Sachdev
Publisher
Springer US, Springer New York
Publication year
2010
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
144193832X
ISBN 13
9781441938329
Item weight
300 grams
Dimensions
235x155x11 mm
Series
Book 2 of 34: Integrated Circuits and Systems

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

Item30 to 40 business days7 to 14 business days
First itemUS$ 71.19US$ 82.77
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