Thermal management concepts in microelectronic packaging: from component to system.
Language: English
Published by The International Society for Hybrid Microelectronics, 1984
- Softcover
- Used
Seller: Adkins Books, Chattanooga, TN, U.S.A.Adkins Books
AbeBooks seller since March 5, 2021
Condition: Used
US$ 25.00
Quantity: 1 available
Add to basketItem description from seller
Very good. No dust jacket as iss.
Seller Inventory # 2009181491
Bibliographic details
- Title
- Thermal management concepts in microelectronic packaging: from component to system.
- Author
- Furkay, Stephen S., and Kilburn, Richard F., and Monti, Gabriel
- Publisher
- The International Society for Hybrid Microelectronics
- Publication year
- 1984
- Binding
- Trade paperback
- Language
- English
- ISBN 10
- 0930815017
- ISBN 13
- 9780930815011
Adkins Books
Chattanooga, TN, U.S.A.
AbeBooks seller since March 5, 2021
Shipping rates within U.S.A.
| Item | 5 to 21 business days | 3 to 6 business days |
|---|---|---|
| First item | US$ 3.99 | US$ 15.00 |
Payment methods
Store description
We have a general selection of books with emphasis on History, Science and Art.
Specialty
General selection.Seller's business information
Adkins Books
TN, U.S.A.
Terms of sale
All books subject to prior sale. We accept Master Card or Visa through abecommerce secure server. Extra postage may be required for international shipments and oversize books or sets.
Shipping terms
Orders usually ship within 2 business days. Insurence included on expensive items. Shipping costs are based on books weighing 2.2 LB, or 1 KG. If your book order is heavy or oversized, we may contact you to let you know extra shipping is required. We ship via US postal services.