Druck auf Anfrage Neuware - Printed after ordering - Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 7 of the Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of sseven from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:Test Design and Inverse Method AlgorithmsInverse Problems: Virtual Fields MethodResidual Stresses: Measurement, Uncertainty & ValidationResidual Stresses: Eigenvalues, Modeling, & Crack GrowthMaterial Characterizations Using ThermographyFatigue, Damage & Fracture Evaluation Using Infrared Thermography.

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Bibliographic Details

Title: Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7 : Proceedings of the 2020 Annual Conference on Experimental and Applied Mechanics
Publisher: Springer, Berlin, Springer
Publication Date: 2021
Language: English
ISBN 10: 3030598632
ISBN 13: 9783030598631
Binding: Buch
Condition: Neu
Dimensions: 279 millimeters width by 210 millimeters height by 11 millimeters depth
Weight: 548 grams

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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 7 of the Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of sseven from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

Test Design and Inverse Method Algorithms

Inverse Problems: Virtual Fields Method

Residual Stresses: Measurement, Uncertainty & Validation

Residual Stresses: Eigenvalues, Modeling, & Crack Growth

Material Characterizations Using Thermography

Fatigue, Damage & Fracture Evaluation Using Infrared Thermography

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