Title: Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7: Proceedings . Society for Experimental Mechanics Series)
Publisher: Springer
Publication Date: 2021
Language: English
ISBN 10: 3030598632
ISBN 13: 9783030598631
Binding: Hardcover
Condition: New

About this title

Synopsis

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 7 of the Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of sseven from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

Test Design and Inverse Method Algorithms

Inverse Problems: Virtual Fields Method

Residual Stresses: Measurement, Uncertainty & Validation

Residual Stresses: Eigenvalues, Modeling, & Crack Growth

Material Characterizations Using Thermography

Fatigue, Damage & Fracture Evaluation Using Infrared Thermography

About the Author

"About this title" may belong to another edition of this title.

Store Description

I mainly carry imported books from South East Asia / South Asia for readers of all Age Groups.

Visit Seller's Storefront

Seller's business information

PLETOS INC
6931 51st Avenue, WOODSIDE, Woodside, NY, 11377, U.S.A.

Sale & Shipping Terms

Terms of Sale

We accept return for those books which are received damaged. Though we take appropriate care in packing to avoid such situation.

Shipping Terms

Shipping rates within U.S.A.

Shipping rates within U.S.A.
Order quantity	12 to 19 business days	12 to 14 business days
First item	US$ 3.99	US$ 6.99

Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.