Thin-Film Capacitors for Packaged Electronics

Eugene J. Rymaszewski

ISBN 10: 140207705X / ISBN 13: 9781402077050

Published by Springer US, Springer US, 2003

About this Item

Druck auf Anfrage Neuware - Printed after ordering - Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.

Seller Inventory # 9781402077050

Bibliographic Details

• Title: Thin-Film Capacitors for Packaged Electronics
• Publisher: Springer US, Springer US
• Publication Date: 2003
• Language: English
• ISBN 10: 140207705X
• ISBN 13: 9781402077050
• Binding: Buch
• Condition: Neu
• Dimensions: 241W x 160H x 15D millimeters 241 millimeters width by 160 millimeters height by 15 millimeters depth
• Weight: 442 grams

About this title

Synopsis

Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.