Topics in Modal Analysis & Parameter Identification, Volume 8 | Proceedings of the 40th IMAC, A Conference and Exposition on Structural Dynamics 2022

Brandon J. Dilworth (u. a.)

ISBN 10: 3031054474 / ISBN 13: 9783031054471

Published by Springer International Publishing, 2023

About this Item

Topics in Modal Analysis & Parameter Identification, Volume 8 | Proceedings of the 40th IMAC, A Conference and Exposition on Structural Dynamics 2022 | Brandon J. Dilworth (u. a.) | Taschenbuch | viii | Englisch | 2023 | Springer International Publishing | EAN 9783031054471 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Seller Inventory # 127243567

Bibliographic Details

• Title: Topics in Modal Analysis & Parameter Identification, Volume 8 | Proceedings of the 40th IMAC, A Conference and Exposition on Structural Dynamics 2022
• Publisher: Springer International Publishing
• Publication Date: 2023
• Language: English
• ISBN 10: 3031054474
• ISBN 13: 9783031054471
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 279W x 210H x 11D millimeters 279 millimeters width by 210 millimeters height by 11 millimeters depth
• Weight: 474 grams
• Seller catalogs:
  • Bücher

About this title

Synopsis

Topics in Modal Analysis & Testing, Volume 8: Proceedings of the 40th IMAC, A Conference and Exposition on Structural Dynamics, 2022, the eighth volume of nine from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Modal Analysis, including papers on:

Operational Modal & Modal Analysis Applications

Experimental Techniques

Modal Analysis, Measurements & Parameter Estimation

Modal Vectors & Modeling

Basics of Modal Analysis

Additive Manufacturing & Modal Testing of Printed Parts

About the Author

 Brandon Dilworth, MIT Lincoln Laboratory, MA, USA; Timothy Marinone, ATA Engineering, Inc., CA, USA; Michael Mains, University of Cincinnati, Ohio, USA