A Transient Study on Heat Dissipation Problem in Microelectronics

Language: English

Published by LAP LAMBERT Academic Publishing Mai 2020, 2020

6202556986 / 9786202556989

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This item is printed on demand - Print on Demand Titel. Neuware -The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks could improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 52 pp. Englisch.…

Seller Inventory # 9786202556989

Title
A Transient Study on Heat Dissipation Problem in Microelectronics
Author
Arulmurugan Loganathan
Publisher
LAP LAMBERT Academic Publishing Mai 2020
Publication year
2020
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
6202556986
ISBN 13
9786202556989
Item weight
96 grams
Dimensions
220x150x4 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

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