Understanding the Reliability Technology Based on Entropy Production, and Other Researches

King-Ning Tu was born on 30 December 1937 in Canton, China is a professor in the Department of Materials Science and Engineering and the Department of Electrical Engineering at UCLA. King has over 500 journal publications with citations over 24,000 and an h-factor of 88 (web-Google). He received the TMS John Bardeen Award in 2013. He has co-authored the textbook Electronic Thin Film Scienceand authored the books Solder Joint Technology: Materials, Properties, and Reliability, and Electronic Thin-Film Reliability. His research is centered on metal–silicon reactions, solder joint reactions, point-contact reactions in nanowires, polarity effect of electromigration on interfacial reactions, and kinetic theories of interfacial reactions. King Tu was an honor as American Physical Society -Fellow, 1981, The Metallurgical Society-Fellow, 1988, Materials Research Society -President, 1981, Fellow 2014, Churchill College -Overseas Fellow, 1990. He received The Metallurgical Society -Application to Practice Award, 1981, Acta/Scripta Metallurgical Lecturer, 1990 –1992, Humboldt Research Award for Senior US scientists, 1996, Member of Academia Sinica, ROC, 2002, TMS-EMPM Division Distinguished Scientist/Engineer Award in 2006, TMS John Bardeen Award in2011, and IEEE Division of Components, Packaging, and Manufacturing Technology Award in 2017.King Tu has been awarded numerous fellowships and letter of appreciation for his tremendous works and research in different fields. ●American Physical Society -Fellow, 1981●The Metallurgical Society -Fellow, 1988●Churchill College -Overseas Fellow, 1990●Materials Research Society -President, 1981●The Metallurgical Society -Application to Practice Award, 1988●Alpha Sigma Mu Lecturer of American Society for Metals, 1986●Acta/Scripta Metallurgica Lecturer, 1990 -1992●Humboldt Research Award for Senior US scientists, 1996●Honorary Member of The Korean Institute of Metals and Materials, 1996●Certificate of Appreciation from SEMATECH for flip-chip study, 1998●Member of Academia Sinica, ROC, 2002King-Ning Tu has published almost 56 articles, research papers on Diffusion and Reactions in Solder Alloys, and around 100 research papers on Silicide Formation. He also has 39 research paper on Electrical Properties and Schottky Barrier of Silicides, 38 papers on Diffusion and Reactions in Metallic Thin Films, and 31 papers on Diffusion and Reactions in Si, SiO2, and Low k Materials. Including these, King has published two books over the title, K. N. Tu, "Electronic Thin-Film Reliability", Cambridge University Press, (2011) and K. N. Tu, J. W. Mayer, and L. C. Feldman, "Electronic Thin Film Science -for Electrical Engineers and Materials Scientists", Macmillan, NY (1992).