VLSI-SoC: Forward-Looking Trends in IC and Systems Design: 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, Madrid, Spain, September 27-29, 2010, Revised Selected Papers (Volume 373)

. Ed(s): Ayala, Jose L.; Atienza Alonso, David; Reis, Ricardo

ISBN 10: 3642285651 / ISBN 13: 9783642285653

Published by Springer, 2012

About this Item

Covers VLSI technology and advanced research. This book addresses the trend towards increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems. Editor(s): Ayala, Jose L.; Atienza Alonso, David; Reis, Ricardo. Series: IFIP Advances in Information and Communication Technology. Num Pages: 368 pages, biography. BIC Classification: TJFC; UMB; UMZ. Category: (P) Professional & Vocational. Dimension: 234 x 156 x 20. Weight in Grams: 691. . 2012. 2012th Edition. hardcover. . . . .

Seller Inventory # V9783642285653

Bibliographic Details

• Title: VLSI-SoC: Forward-Looking Trends in IC and Systems Design: 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, Madrid, Spain, September 27-29, 2010, Revised Selected Papers (Volume 373)
• Publisher: Springer
• Publication Date: 2012
• Language: English
• ISBN 10: 3642285651
• ISBN 13: 9783642285653
• Binding: Hardcover
• Condition: New

About this title

Synopsis

This book contains extended and revised versions of the best papers presented at the 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.