Wafer Bonding : Applications and Technology

Language: English

Published by Springer, 2011

3642059155 / 9783642059155

Series: Book 62 of 233 - Springer Series in Materials Science

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Item description from seller

Druck auf Anfrage Neuware - Printed after ordering - During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Seller Inventory # 9783642059155

Title
Wafer Bonding : Applications and Technology
Author
Marin Alexe
Publisher
Springer
Publication year
2011
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3642059155
ISBN 13
9783642059155
Item weight
785 grams
Dimensions
235x155x29 mm
Series
Book 62 of 233: Springer Series in Materials Science

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

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