This item is printed on demand - it takes 3-4 days longer - Neuware -Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-Level Packaging (WLP) refers to the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging has the ability to enable true integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. 88 pp. Englisch.

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Bibliographic Details

Title: Wafer-Level Packaging
Publisher: Omniscriptum M�r 2026
Publication Date: 2026
Binding: Taschenbuch
Condition: Neu
Dimensions: 220 millimeters width by 150 millimeters height by 6 millimeters depth
Weight: 149 grams

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