Wide Bandgap Based Devices Design, Fabrication and Applications

Language: English

Published by MDPI AG, 2021

3036505660 / 9783036505664

  • Hardcover
  • New
See all details

Seller: Home-set, Mannheim, GermanyHome-set

5-star seller

AbeBooks seller since April 13, 2026

Hardcover

Condition: New

US$ 125.16

US$ 55.00 shipping 
Ships from Germany to U.S.A.

Quantity: 2 available

Add to basket
Free 30-day returns

Item description from seller

Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as "ultra-wide bandgap" materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III-V, and other compound semiconductor devices and integrated circuits. In particular, the following topics are addressed: - GaN- and SiC-based devices for power and optoelectronic applications - Ga2O3 substrate development, and Ga2O3 thin film growth, doping, and devices - AlN-based emerging material and devices - BN epitaxial growth, characterization, and devices Sprache: Englisch Gewicht in Gramm: 748. …

Title
Wide Bandgap Based Devices Design, Fabrication and Applications
Publisher
MDPI AG
Publication year
2021
Condition
Neu
Binding
Gebundene Ausgabe
Language
English
ISBN 10
3036505660
ISBN 13
9783036505664
Item weight
748 grams

Home-set

Mannheim, Germany

5-star seller

AbeBooks seller since April 13, 2026

Shipping rates from Germany to U.S.A.

Item10 to 12 business days8 to 10 business days
First itemUS$ 55.00US$ 82.66
Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.

Payment methods

  • Visa
  • Mastercard
  • American Express
  • Apple Pay
  • Google Pay
  • Check

Specialty

Buch

Seller's business information

Home-set

Germany