Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)
Language: English
Published by Woodhead Publishing, 2018
Series: Book 110 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
- New

Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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In English.
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- Title
- Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)
- Publisher
- Woodhead Publishing
- Publication year
- 2018
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 0081020945
- ISBN 13
- 9780081020944
- Item weight
- 492 grams
- Series
- Book 110 of 203: Woodhead Publishing Series in Electronic and Optical Materials
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.
As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.
- Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance
- Provides the latest research on potential solutions, with an eye towards the end goal of system integration
- Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
"Synopsis" may belong to another edition of this title.
About the Author
He has published several academic papers and books during his career, and has won many prestigious awards such as Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics and the Richard M. Fularth Pacific Award. He has worked as Professor at Osaka University Institute of Scientific and Industrial Research since 1996.
"About the title" may belong to another edition of this title.
Ria Christie Collections
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