Wire Bonding in Microelectronics : Reliability Analysis and Process Optimization

Language: English

Published by Our Knowledge Publishing, 2026

6630598644 / 9786630598643

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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nach der Bestellung gedruckt Neuware - Printed after ordering - The semiconductor assembly process involves several steps, but the most important one is wire bonding. This step is considered the most delicate compared to other processes because it involves connecting the chip's bond pads to the package substrate. This book presents the optimization of the copper wire bonding (CWB) process, in which gold wire is replaced with copper wire, and the optimal process parameters are determined through reliability analysis, with the ultimate goal of improving product quality. Once the process study is complete and machine operation has been mastered, the next step is to define a design of experiments using specific software to identify the main factors influencing the copper wire bonding process. Finally, the bond pads are validated in accordance with quality requirements regarding reliability.

Seller Inventory # 9786630598643

Title
Wire Bonding in Microelectronics : Reliability Analysis and Process Optimization
Author
Ouadia Mouhat
Publisher
Our Knowledge Publishing
Publication year
2026
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
6630598644
ISBN 13
9786630598643
Item weight
107 grams
Dimensions
220x150x4 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

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