John H. Lau

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Solder Joint Reliability: Theory and Applications
Lau, John H.

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US$ 17.97

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Lau, John H.; Pao, Yi-Hsin

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US$ 23.25

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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.

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US$ 34.72

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Flip Chip Technologies
Lau, John H.

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US$ 44.90

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Advanced MEMS Packaging
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

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US$ 39.99

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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
Lau, John H.

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US$ 98.96

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Semiconductor Advanced Packaging
Lau, John H.

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US$ 111.57

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Through-Silicon Vias for 3D Integration
Lau, John H.

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US$ 107.06

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