John H. Lau
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Solder Joint Reliability: Theory and Applications
Lau, John H.
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Electronic Packaging: Design, Materials, Process, and Reliability
Lau, John H.; Wong, C.P.; Prince, J.L.
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Handbook of Fine Pitch Surface Mount Technology
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Lau, John H.; Pao, Yi-Hsin
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Advanced MEMS Packaging
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.
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