John H. Lau
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Lau, John H.; Pao, Yi-Hsin
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View 9 offersUS$ 5.99
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Lau, John H.
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View 3 offersUS$ 4.13
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Solder Joint Reliability: Theory and Applications
Lau, John H.
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View 30 offersUS$ 21.17
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.
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View 14 offersUS$ 33.08
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Advanced MEMS Packaging
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu
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View 12 offersUS$ 39.99
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Chip Scale Package: Design, Materials, Process, Reliability, and Applications
Lau, John H.; Lee, Ricky S.W.; Lee, S.W. Ricky
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View 1 offerUS$ 23.37
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
Lau, John H.
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View 8 offersUS$ 98.86
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