John H. Lau
Popular items by John H. Lau
View all offers-
-
Solder Joint Reliability: Theory and Applications
Lau, John H.
Item prices starting from
View 34 offersUS$ 17.97
-
-
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Lau, John H.; Pao, Yi-Hsin
Item prices starting from
View 9 offersUS$ 27.72
-
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.
Item prices starting from
View 15 offersUS$ 32.85
-
Through-Silicon Vias for 3D Integration
Lau, John H.
Item prices starting from
View 12 offersUS$ 109.25
-
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
Lau, John H.
Item prices starting from
View 8 offersUS$ 101.28
-
Showing 8 of 25 titles