John H. Lau
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Lau, John H.; Pao, Yi-Hsin
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Lau, John H.
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View 2 offersUS$ 4.13
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Solder Joint Reliability: Theory and Applications
Lau, John H.
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.
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View 13 offersUS$ 35.00
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Through-Silicon Vias for 3D Integration
Lau, John H.
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View 12 offersUS$ 107.00
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
Lau, John H.
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View 8 offersUS$ 98.91
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