John H. Lau

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Ball Grid Array Technology
Lau, John H.

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US$ 3.71

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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Lau, John H.

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US$ 5.00

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Solder Joint Reliability: Theory and Applications
Lau, John H.

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US$ 14.02

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Electronic Packaging: Design, Materials, Process, and Reliability
Lau, John H.; Wong, C.P.; Prince, J.L.

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US$ 13.76

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Lau, John H.; Pao, Yi-Hsin

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US$ 23.05

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Handbook of Fine Pitch Surface Mount Technology

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US$ 11.97

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Flip Chip Technologies
Lau, John H.

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US$ 36.24

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Advanced MEMS Packaging
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

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US$ 39.99

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