Phil Marcoux

Phil’s developments in 2.5D and 3D packaging represent his fourth major new business development. He has been a pioneer in laser trimmed IC devices, surface mount technology, wafer level packaging and now 3D.

A common thread in his industry involvement is multi-chip IC packaging.

Phil has been co-founder and CEO of three Silicon Valley based companies and technical adviser to many.

He was co-inventor and owner of over 38 issued patents in the area of Wafer Level Packaging, Chip Scale packaging Silicon Interposers, and 2.5D packaging.

Author of one of the first textbooks on fine pitch SMT packaging and processes titled “Fine Pitch Surface Mount Technology”. Published by Van Nostrand in 1992. ISBN 0-442-00862-7.

In 2007 Phil was named “The Father of Surface Mount Assembly in the US” by the IPC.

He received his BSEE from University of Florida and MSEE/MBA from Santa Clara University.

Currently he’s a technical consultant to electronic companies in the Santa Clara/Silicon Valley area, a recipient of the IPC President’s award, a member of the MEPTEC Advisory Board, a past member of the University of Florida College of Engineering Advisory Board, and Past Vice President of the Packaging Division of the FOA – Fab Owner’s Association.