Bajenescu (52 results)
Language: German
Published by Verlag Technische Rundschau im Hallwag-Verlag, Bern, 1979
- Softcover
Seller: avelibro OHG, Dinkelscherben, Germanyavelibro OHG
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Condition: Used - Fine
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Add to basket4°, Broschur. Condition: Sehr gut. 146 Seiten, 3 Bl. Ausgetragenes Bibliotheksexemplar, Buch ist in einem sehr guten Zustand. Einband leicht berieben, Ecken und Kanten leicht berieben, Papier in sehr gutem Zustand. B03-04-02H Sprache: Deutsch Gewicht in Gramm: 470.
Language: English
Published by Wiley, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: New.
Language: English
Published by Wiley, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: As New. Unread book in perfect condition.
Language: English
Published by Wiley, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In.
Language: English
Published by Wiley, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 112.41
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- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
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US$ 124.71
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
- Hardcover
Seller: BOOKWEST, Phoenix, AZ, U.S.A.BOOKWEST
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Hardcover. Condition: New. SHRINK-WRAPPED: US SELLER SHIPS FROM USA.
Language: English
Published by Wiley, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 128.77
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Condition: As New. Unread book in perfect condition.
Language: English
Published by John Wiley and Sons Inc, US, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
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US$ 145.80
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Hardback. Condition: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices an…d processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In.
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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US$ 130.99
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PF. Condition: New.
Language: English
Published by Wiley, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 149.00
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Condition: New.
Language: English
Published by John Wiley & Sons, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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US$ 143.38
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Condition: New. pp. xxii + 317 Illus.
- Hardcover
Seller: Buchpark, Trebbin, GermanyBuchpark
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US$ 41.61
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Condition: Sehr gut. Zustand: Sehr gut | Seiten: 509 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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US$ 152.96
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Hardcover. Condition: Brand New. 509 pages. 9.50x6.25x1.25 inches. In Stock.
Language: English
Published by John Wiley & Sons, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. pp. xxii + 317.
- Hardcover
Seller: moluna, Greven, Germanymoluna
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US$ 116.11
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Condition: New. The objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of el.
- Softcover
- Signed
Seller: Antiquariat ARS LIBRI, Andreas Lutz, Windeck, GermanyAntiquariat ARS LIBRI, Andreas Lutz
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US$ 23.27
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Add to basketBerlin, VDE Verlag 1985. 448 Seiten m. zahlreichen Abbildungen. Orig. Softcover, 8°. Gut erhalten. Mit Widmung des Verfassers verso Titelblatt.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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US$ 166.70
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 197.53
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Condition: New. pp. 558.
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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US$ 133.06
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Taschenbuch. Condition: Neu. Reliability of Electronic Components | A Practical Guide to Electronic Systems Manufacturing | Titu I. Bajenescu (u. a.) | Taschenbuch | xli | Englisch | 2012 | Springer | EAN 9783642636257 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]har…tmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by John Wiley & Sons Inc, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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US$ 203.87
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Hardcover. Condition: Brand New. 1st edition. 344 pages. 10.00x6.00x0.75 inches. In Stock.
Language: English
Published by John Wiley and Sons Inc, US, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
Contact seller5-star sellerCondition: New
US$ 140.21
US$ 86.94 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Hardback. Condition: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices an…d processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 156.00
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The first detailed studies of electronic components reliability were undertaken to improve the performance of communications and navigational systems used by the American army. The techniques then developed were subsequently refined and applied to…equipment used for many other applications where high reliability was of paramount importance - for example in civil airline electronic systems. The evolution of good and reliable products is the responsibility of technical and professional persons, engineers and designers. These individuals cannot succeed unless they are given adequate opportunity to apply their arts and mysteries so as to bring the end-product to the necessary level of satisfaction. Few managements, however, are yet aware of the far greater potential value of the reliability of their products or services. Yet customer satisfaction depends, in most cases, far more on the reliability of performance than on quality in the industrial sense. There was a time when reliable design could be prescribed simply as 'picking good parts and using them right'. Nowadays the complexity of systems, particularly electronic systems, and the demand for ultrahigh reliability in many applications mean that sophisticated methods based on numerical analysis and probability techniques have been brought to bear - particularly in the early stages of design - on determining the feasibility of systems.
Language: English
Published by Wiley Apr 2011, 2011
Series: Quality and Reliability Engineering, Book 2 of 19. Book 2 of 19 - Quality and Reliability Engineering
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 161.18
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Buch. Condition: Neu. Neuware - Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devi…ces and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal.Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use.Inside you will find detailed coverage on:\* a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved\* the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions\* the design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability)\* failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability\* reliability resting after fabrication, including reliability assessment at this stage and corrective actions\* a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods\* new challenges in reliability testing, such as its use in microsystems and nanostructuresThis practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 243.85
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 366.45
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Condition: As New. Unread book in perfect condition.
