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Elektronik und Zuverlässigkeit ( = Blaue TR-Reihe Heft 132) Technische Rundschau
Language: German
Published by Verlag Technische Rundschau im Hallwag-Verlag, Bern, 1979
Seller: avelibro OHG, Dinkelscherben, Germany
Association Member: BOEV
Seller rating 5 out of 5 stars
4°, Broschur. Condition: Sehr gut. 146 Seiten, 3 Bl. Ausgetragenes Bibliotheksexemplar, Buch ist in einem sehr guten Zustand. Einband leicht berieben, Ecken und Kanten leicht berieben, Papier in sehr gutem Zustand. B03-04-02H Sprache: Deutsch Gewicht in Gramm: 470.
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Reliability of Electronic Components: A Practical Guide to Electronic Systems Manufacturing
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Reliability of Electronic Components : A Practical Guide to Electronic Systems Manufacturing
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems (Quality and Reliability Engineering Series)
Book 2 of 19: Quality and Reliability EngineeringSeller: Ria Christie Collections, Uxbridge, United Kingdom
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Failure Analysis : A Practical Guide for Manufacturers of Electronic Components and Systems
Book 2 of 19: Quality and Reliability EngineeringSeller: GreatBookPricesUK, Woodford Green, United Kingdom
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Failure Analysis : A Practical Guide for Manufacturers of Electronic Components and Systems
Book 2 of 19: Quality and Reliability EngineeringSeller: GreatBookPricesUK, Woodford Green, United Kingdom
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Failure Analysis
Book 2 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley and Sons Inc, US, 2011
ISBN 10: 0470748249 ISBN 13: 9780470748244
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
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Add to basketHardback. Condition: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
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Component Reliability for Electronic Systems (Artech House Remote Sensing Library)
Language: English
Published by Artech House Publishers, 2009
ISBN 10: 1596934360 ISBN 13: 9781596934368
Hardcover. Condition: New. SHRINK-WRAPPED: US SELLER SHIPS FROM USA.
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Reliability of Electronic Components: A Practical Guide to Electronic Systems Manufacturing
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Add to basketCondition: New. pp. xxii + 317 Illus.
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Condition: Sehr gut. Zustand: Sehr gut | Seiten: 509 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Add to basketHardcover. Condition: Brand New. 509 pages. 9.50x6.25x1.25 inches. In Stock.
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Condition: New. pp. xxii + 317.
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Add to basketCondition: New. The objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of el.
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Add to basketHardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: New. pp. 558.
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Component Reliability for Electronic Systems
Language: English
Published by Artech House Publishers, 2009
ISBN 10: 1596934360 ISBN 13: 9781596934368
First Edition
Couverture rigide. Condition: Neuf. Edition originale.
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Zuverlässigkeit elektronischer Komponenten
Seller: Antiquariat ARS LIBRI, Andreas Lutz, Windeck, Germany
Seller rating 5 out of 5 stars
Signed
Berlin, VDE Verlag 1985. 448 Seiten m. zahlreichen Abbildungen. Orig. Softcover, 8°. Gut erhalten. Mit Widmung des Verfassers verso Titelblatt.
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Taschenbuch. Condition: Neu. Reliability of Electronic Components | A Practical Guide to Electronic Systems Manufacturing | Titu I. Bajenescu (u. a.) | Taschenbuch | xli | Englisch | 2012 | Springer | EAN 9783642636257 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Failure Anaylsis A Practical Guide for Manufacturers of Electronic Components and Systems
Book 2 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley & Sons Inc, 2011
ISBN 10: 0470748249 ISBN 13: 9780470748244
US$ 203.16
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Add to basketHardcover. Condition: Brand New. 1st edition. 344 pages. 10.00x6.00x0.75 inches. In Stock.
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Failure Analysis
Book 2 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley and Sons Inc, US, 2011
ISBN 10: 0470748249 ISBN 13: 9780470748244
US$ 140.76
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Add to basketHardback. Condition: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
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US$ 226.81
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Reliability of Electronic Components : A Practical Guide to Electronic Systems Manufacturing
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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US$ 356.82
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Condition: As New. Unread book in perfect condition.
