Dutt Nikil (107 results)

hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Condition: New. pp. 202.

Condition: New.

Condition: New. pp. 202 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Condition: New. pp. 202.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condition: As New. Unread book in perfect condition.

Hardcover. Condition: Very Good. Includes CD. This book is in very good condition; no remainder marks. It does have some cover shelfwear. Creasing to top corner of last 70 pages from improper storage. Inside pages are clean. ; 6.24 X 0.8 X 9.58 inches; 256 pages.

hardcover. Condition: Hardcover. Hardcover. New, unused. gift inscribedclear text,For any additional information or pictures, please inquire.

Condition: New.

Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Gebundene Ausgabe. Condition: Sehr gut. Gebraucht - Sehr gut sg - leichte beschädigungen oder verschmutzungen, ungelesenes mängelexemplar, gestempelt - Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. This book is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. KEY FEATURES A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends Detailed analysis of all popular standards for on-chip communication architectures Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts Future trends that with have a significant impact on research and design of communication architectures over the next several years.…

Condition: New.

Condition: New. In English.

Condition: As New. Unread book in perfect condition.

Condition: New.

hardcover. Condition: Wie neu. 544 Seiten; 9780123738929.1 Gewicht in Gramm: 2.

Condition: New. In English.

Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today's points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc.Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems;Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers;Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.…

Hardcover. Condition: Brand New. 621 pages. 9.25x6.10x1.61 inches. In Stock.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condition: As New. Unread book in perfect condition.

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: As New. Unread book in perfect condition.

Condition: As New. Unread book in perfect condition.

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: New.