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Published by Springer Nature Switzerland AG, Cham, 2023
ISBN 10: 3030861732 ISBN 13: 9783030861735
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Hardcover. Condition: new. Hardcover. This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers. This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Published by Springer Nature Switzerland AG, CH, 2023
ISBN 10: 3030861732 ISBN 13: 9783030861735
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Published by Springer Nature Switzerland AG, CH, 2024
ISBN 10: 3030861767 ISBN 13: 9783030861766
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Published by Springer Nature Switzerland AG, CH, 2023
ISBN 10: 3030861732 ISBN 13: 9783030861735
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Condition: Hervorragend. Zustand: Hervorragend | Seiten: 310 | Sprache: Englisch | Produktart: Bücher | This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the "thermal and electro-thermal system simulation" Special Issue of Energies. These contributions present the latest results in a currently very "hot" topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
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Condition: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.