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Rettberg Achim (260 results)
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Condition: As New. Unread book in perfect condition.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Self-Organization in Embedded Real-Time Systems.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
IX, 208 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.
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Condition: New. pp. 464.
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Condition: New. pp. 464 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New. pp. 464.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Hardback or Cased Book. Condition: New. New Trends and Technologies in Computer-Aided Learning for Computer-Aided Design: Ifip International Working Conference: Edutech 2005, Perth, Australi. Book.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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hardcover. Condition: Good. Crease on cover*.
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Hardcover. Condition: Très bon. Edition 2007. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Edition 2007. Ammareal gives back up to 15% of this item's net price to charity organizations.
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International EditionCondition: New. Brand New ! Fast Delivery "International Edition " and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 4-6 Working days .and we do have flat rate for up to 2LB. Extra shipping charges will be requested This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
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From specification to embedded systems application : IFIP TC10 working conference: International embedded systems symposium (IESS), August 15-17, 2005, Manaus, Brazil
Published by New York, Springer 2005 figures, 2005
Seller: Antiquarian Bookshop Klikspaan, Leiden, Netherlands
Seller rating 4 out of 5 stars
First Edition
1st ed. - Hardcover, as new.
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Condition: As New. Unread book in perfect condition.
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Condition: As New. Unread book in perfect condition.
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System Level Design from HW/SW to Memory for Embedded Systems (Hardcover)
Book 176 of 292: IFIP Advances in Information and Communication TechnologyLanguage: English
Published by Springer International Publishing AG, Cham, 2018
ISBN 10: 3319900226 ISBN 13: 9783319900223
Hardcover. Condition: new. Hardcover. This book constitutes the refereed proceedings of the 5th IFIP TC 10 International Embedded Systems Symposium, IESS 2015, held in Foz do Iguacu, Brazil, in November 2015.The 18 full revised papers presented were carefully reviewed and selected from 25 submissions. The papers present a broad discussion on the design, analysis and verification of embedded and cyber-physical systems including design methodologies, verification, performance analysis, and real-time systems design. They are organized in the following topical sections: cyber-physical systems, system-level design; multi/many-core system design; memory system design; and embedded HW/SW design and applications. The papers present a broad discussion on the design, analysis and verification of embedded and cyber-physical systems including design methodologies, verification, performance analysis, and real-time systems design. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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New Trends and Technologies in Computer-Aided Learning for Computer-Aided Design: IFIP International Working Conference: EduTech 2005, Perth, ... and Communication Technology, 192)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 70.41
US$ 16.12 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Design Methods and Applications for Distributed Embedded Systems: IFIP 18th World Computer Congress, TC10 Working Conference on Distributed and ... in Information and Communication Technology)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 70.41
US$ 16.12 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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US$ 66.26
US$ 20.85 shipping
Ships from United Kingdom to U.S.A.Quantity: 10 available
Add to basketPaperback. Condition: New.
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New Trends And Technologies in Computer-aided Learning for Computer-aided Design : IFIP TC10 Working Conference: EduTech 2005, October 20-21, Perth, Australia
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 69.18
US$ 20.19 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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International Edition
US$ 81.18
US$ 8.06 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Brand New ! Fast Delivery "International Edition " and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 4-6 Working days .and we do have flat rate for up to 2LB. Extra shipping charges will be requested This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
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Condition: New. pp. 147.
