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  • Language: English

    Published by Springer International Publishing AG, Cham, 2016

    3031009029 / 9783031009020

    • Softcover

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    Paperback. Condition: new. Paperback. RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments andthe electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAMs potential novel applications beyond the NVM applications. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

  • Language: English

    Published by Morgan & Claypool Publishers (edition ), 2016

    1627059296 / 9781627059299

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    Paperback. Condition: Very Good. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

  • Language: English

    Published by Morgan & Claypool Publishers (edition ), 2016

    1627059296 / 9781627059299

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    Paperback. Condition: Very Good. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

  • Language: English

    Published by Morgan & Claypool Publishers (edition ), 2016

    1627059296 / 9781627059299

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    Paperback. Condition: New. The item is brand new, never used or read. It's in perfect condition and may include supplements and/or access codes or come shrink-wrapped.

  • Language: English

    Published by Springer, 2016

    3031009029 / 9783031009020

    • Softcover

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    Paperback. Condition: Brand New. 78 pages. 9.25x7.51x9.25 inches. In Stock.

  • Language: English

    Published by Morgan & Claypool Publishers, 2016

    1627059296 / 9781627059299

    • Softcover

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    Condition: New. pp. 80.

  • Language: English

    Published by Morgan & Claypool Publishers, 2016

    1627059296 / 9781627059299

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    Condition: New. pp. 80.

  • Language: English

    Published by Springer, 2016

    3031009029 / 9783031009020

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    Condition: New. 1st edition NO-PA16APR2015-KAP.

  • Language: English

    Published by Morgan & Claypool Publishers, 2016

    1627059296 / 9781627059299

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    Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios

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    Condition: New. pp. 80.

  • Language: English

    Published by Morgan & Claypool Publishers, 2016

    1627059296 / 9781627059299

    • Softcover

    Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International

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    Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

    • Softcover

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  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

    • Softcover

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    PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.

  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

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  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

    • Softcover

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    PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.

  • Language: English

    Published by Taylor and Francis Ltd, GB, 2025

    0367687151 / 9780367687151

    • Softcover

    Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA

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    Paperback. Condition: New. This book covers semiconductor memory technologies from device bit-cell structures to memory array design with an emphasis on recent industry scaling trends and cutting-edge technologies. The first part of the book discusses the mainstream semiconductor memory technologies. The second part of the book discusses the emerging memory candidates that may have the potential to change the memory hierarchy, and surveys new applications of memory technologies for machine/deep learning applications. This book is intended for graduate students in electrical and computer engineering programs and researchers or industry professionals in semiconductors and microelectronics. Explains the design of basic memory bit-cells including 6-transistor SRAM, 1-transistor-1-capacitor DRAM, and floating gate/charge trap FLASH transistor Examines the design of the peripheral circuits including the sense amplifier and array-level organization for the memory array Examines industry trends of memory technologies such as FinFET based SRAM, High-Bandwidth-Memory (HBM), 3D NAND Flash, and 3D X-point array Discusses the prospects and challenges of emerging memory technologies such as PCM, RRAM, STT-MRAM/SOT-MRAM and FeRAM/FeFET Explores the new applications such as in-memory computing for AI hardware acceleration.

  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

    • Softcover

    Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK

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  • Language: English

    Published by Springer, 2016

    3031009029 / 9783031009020

    • Softcover

    Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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    Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments andthe electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAM's potential novel applications beyond the NVM applications.

  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

    • Softcover

    Seller: California Books, Miami, FL, U.S.A.California Books

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  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

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    Seller: Chiron Media, Wallingford, United KingdomChiron Media

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    paperback. Condition: New.

  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

    • Softcover

    Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections

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  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

    • Softcover

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  • Language: English

    Published by Springer International Publishing AG, Cham, 2016

    3031009029 / 9783031009020

    • Softcover

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    Paperback. Condition: new. Paperback. RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments andthe electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAMs potential novel applications beyond the NVM applications. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

  • Language: English

    Published by Taylor & Francis Ltd, 2025

    0367687151 / 9780367687151

    • Softcover

    Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE

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    Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.

  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

    • Softcover

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  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

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    Language: English

    Published by Springer, 2016

    3031009029 / 9783031009020

    • Softcover

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    Taschenbuch. Condition: Neu. Resistive Random Access Memory (RRAM) | Shimeng Yu | Taschenbuch | Synthesis Lectures on Emerging Engineering Technologies | vii | Englisch | 2016 | Springer | EAN 9783031009020 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

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  • Language: English

    Published by CRC Pr I Llc, 2025

    0367687151 / 9780367687151

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    Seller: Revaluation Books, Exeter, United KingdomRevaluation Books

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    Paperback. Condition: Brand New. 214 pages. 9.18x6.12x9.21 inches. In Stock.

  • Language: English

    Published by CRC Press, 2025

    0367687151 / 9780367687151

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    Condition: New. Shimeng Yu is currently an associate professor of electrical and computer engineering at the Georgia Institute of Technology.This book covers semiconductor memory technologies from device bit-cell structures to memory array design with an emph.

  • Language: English

    Published by CRC Press, 2022

    0367687070 / 9780367687076

    • Hardcover

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