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Tummala R R Rymaszewski Eugene Klopfenstein (42 results)
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Condition: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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hardcover. Condition: Very Good. 2nd. Used - Very Good.
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Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 2.6.
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Microelectronics Packaging Handbook: Technology Drivers Part I
Published by Springer (edition 2nd), 1997
ISBN 10: 0412084317 ISBN 13: 9780412084317
Language: English
Hardcover. Condition: Good. 2nd. It's a preowned item in good condition and includes all the pages. It may have some general signs of wear and tear, such as markings, highlighting, slight damage to the cover, minimal wear to the binding, etc., but they will not affect the overall reading experience.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Condition: acceptable. A readable copy. All pages are intact, and the cover is intact. Dust jacket may be missing. Pages can include considerable highlighting markings writing but cannot obscure the text. May be an Ex-lib. copy and have standard library stamps and or stickers. May NOT include discs, or access code or other supplemental material. We ship Monday-Saturday and respond to inquiries within 24 hours.
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Condition: New. pp. 1000 2nd Edition.
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US$ 58.74
Convert currencyUS$ 8.66 shipping from United Kingdom to U.S.A.Quantity: 4 available
Add to basketCondition: New. pp. 1000.
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Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Published by Chapman & Hall, New York, 1997
ISBN 10: 0412084414 ISBN 13: 9780412084416
Language: English
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
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US$ 64.22
Convert currencyUS$ 11.55 shipping from Germany to U.S.A.Quantity: 4 available
Add to basketCondition: New. pp. 1000.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Condition: New.
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Condition: New.
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US$ 179.25
Convert currencyUS$ 3.99 shipping within U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Condition: New.
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 191.04
Convert currencyUS$ 15.96 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Microelectronics Packaging Handbook : Subsystem Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 190.94
Convert currencyUS$ 19.98 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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US$ 94.69
Convert currencyFree shipping from Australia to U.S.A.Quantity: Over 20 available
Add to basketBrand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
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hardcover. Condition: Very Good. 2nd. Used - Very Good.
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US$ 230.98
Convert currencyUS$ 3.99 shipping within U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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US$ 231.21
Convert currencyUS$ 3.99 shipping within U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Condition: New.
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Microelectronics Packaging Handbook: Technology Drivers Part I
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 252.65
Convert currencyUS$ 15.96 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Microelectronics Packaging Handbook: Technology Drivers Part I
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 252.65
Convert currencyUS$ 15.96 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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US$ 213.17
Convert currencyUS$ 56.85 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketGebunden. Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
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Condition: New.
