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Published by Intext Educational Publishers, 1973
ISBN 10: 0700224378ISBN 13: 9780700224371
Seller: BookHolders, Towson, MD, U.S.A.
Book
Condition: Good. [ No Hassle 30 Day Returns ][ Ships Daily ] [ Underlining/Highlighting: NONE ] [ Writing: NONE ] [ Edition: first ] Publisher: Intext Educational Publishers Pub Date: 1/1/1973 Binding: Hardcover Pages: 578 first edition.
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Published by Springer, 1988
ISBN 10: 0442205783ISBN 13: 9780442205782
Seller: HPB-Red, Dallas, TX, U.S.A.
Book
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
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Published by Mc Graw Hill India, 2020
ISBN 10: 9390385512ISBN 13: 9789390385515
Seller: Books in my Basket, New Delhi, India
Book
Soft cover. Condition: New. ISBN:9789390385515,Territorial restriction maybe printed on the book. This is an Int'l edition, ISBN and cover may differ from US edition, Contents same as US edition.
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Published by HMSO, 1974
Seller: Cambridge Rare Books, Cambridge, GLOUC, United Kingdom
First Edition
Hardback. Condition: GOOD. 1st Edition. 1974. HMSO. First. Disbound loose sheets with clear protective covers. 7.5x11. Complete specification for patent application together with drawings.
Published by HMSO, 1976
Seller: Cambridge Rare Books, Cambridge, GLOUC, United Kingdom
First Edition
Hardback. Condition: GOOD. 1st Edition. 1976. HMSO. First. Disbound loose sheets with clear protective covers. 7.5.x11. Complete specification for patent application.
Published by HMSO, 1974
Seller: Cambridge Rare Books, Cambridge, GLOUC, United Kingdom
First Edition
Hardback. Condition: GOOD. 1st Edition. 1974. HMSO. First. Disbound loose sheets with clear protective covers. 7.5.x11. Complete specification for patent application.
Published by Springer, 1998
ISBN 10: 0412085615ISBN 13: 9780412085611
Seller: Books Puddle, New York, NY, U.S.A.
Book
Condition: New. pp. 1000 2nd Edition.
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Published by Chapman, 1997
Seller: Martinton Book Company, Martinton, IL, U.S.A.
New Condition. Hardbound. No Marks.
Published by Van Nostrand Reinhold Company, New York, 1989
Seller: J. Wyatt Books, Ottawa, ON, Canada
Hard Cover. 1194 pages. Illustrated with figures, graphs and tables. Pages v/g condiition, clean. Previous owner's name on both paste down endpapers. Black cloth, silver titles. Purple dust jacket illustrated in color on upper cover. NF/NF.
Published by McGraw Hill, New York, 2001
ISBN 10: 0071371699ISBN 13: 9780071371698
Book First Edition
Hard Cover. Condition: Good. No Jacket. First Edition. From an academic library with the usual stamps etc. This item is heavy and will attract postal surcharges. B00004734.
Published by McGraw-Hill Education, 2001
ISBN 10: 0071371699ISBN 13: 9780071371698
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: Very Good. Book is in Used-VeryGood condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear and contain very limited notes and highlighting.
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Published by McGraw Hill, 2019
ISBN 10: 1259861554ISBN 13: 9781259861550
Seller: GF Books, Inc., Hawthorne, CA, U.S.A.
Book
Condition: Good. Book is in Used-Good condition. Pages and cover are clean and intact. Used items may not include supplementary materials such as CDs or access codes. May show signs of minor shelf wear and contain limited notes and highlighting.
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Published by Division of Research, Graduate School of Business, 1976
ISBN 10: 0877441316ISBN 13: 9780877441311
Seller: Mispah books, Redhill, SURRE, United Kingdom
Book
paperback. Condition: Very Good. Very Good. book.
Published by McGraw Hill, 2008
ISBN 10: 0071459065ISBN 13: 9780071459068
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
Book
Condition: New.
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Published by Southeast University Press, 1991
ISBN 10: 7810894196ISBN 13: 9787810894197
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Language:Chinese.Paperback. Publisher: Southeast University Press. The book include: microelectronics. photonics. RF. MEMS base.
Published by Springer, 2000
ISBN 10: 0792352181ISBN 13: 9780792352181
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
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Published by Springer, 1997
ISBN 10: 0412084511ISBN 13: 9780412084515
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Chemical Industry Press, 2014
ISBN 10: 712219406XISBN 13: 9787122194060
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Paperback. Pub Date :2014-07-01 Pages: 557 Language: Chinese Publisher: Chemical Industry Press. the book is about the electronic packaging system in package (SystemonPackage. SOP) is a professional writings. Written by leading experts in the field of electronic packaging - Fellow of the American Academy of Engineering. Professor Rao RTummala and edited by Professor Madhavan Swaminathan. has long been engaged by a number of micro-nano manufacturing. electronic packaging technology research th.
Published by Springer, 2012
ISBN 10: 1461368294ISBN 13: 9781461368298
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Springer, 1997
ISBN 10: 0412084317ISBN 13: 9780412084317
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Machinery Industry Press, 2021
ISBN 10: 7111675665ISBN 13: 9787111675662
Seller: liu xing, Nanjing JiangSu, JS, China
Book
paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2021-06-01 Publisher: Machinery Industry Press The whole book is divided into two parts. the basic principles of packaging and the application of technology. with 22 chapters in total.?Discuss thermal-mechanical reliability. micro- and nano-level packaging. ceramic. organic materials. glass and silicon packaging substrates. radio frequency and millimeter wave packaging. MEMS and sensor packaging. PCB packaging and board-level assembly; packaging technolog.
Published by Springer, 1997
ISBN 10: 0412084414ISBN 13: 9780412084416
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.