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9780415311908 - Microelectronic Packaging New Trends in Electrochemical Technology (12 results)
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Condition: Like New. Page block firm and clean, binding unblemished, boards straight, without markings of any kind. Fine, like new condition. Extremely fine. Previous owners name on the inside of front endpaper. Well packaged and promptly shipped from California. Partnered with Friends of the Library since 2010.
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Hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Microelectronic Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 352.04
US$ 20.09 shipping
Ships from United Kingdom to U.S.A.Quantity: 10 available
Add to basketCondition: New.
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Microelectronic Packaging (New Trends in Electrochemical Technology)
Language: English
Published by CRC Press 2004-12-20, 2004
ISBN 10: 041531190X ISBN 13: 9780415311908
US$ 348.62
US$ 20.75 shipping
Ships from United Kingdom to U.S.A.Quantity: 5 available
Add to basketHardcover. Condition: New.
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Microelectronic Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 383.14
US$ 20.09 shipping
Ships from United Kingdom to U.S.A.Quantity: 10 available
Add to basketCondition: As New. Unread book in perfect condition.
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Microelectronic Packaging
Language: English
Published by Taylor & Francis Group, 2004
ISBN 10: 041531190X ISBN 13: 9780415311908
Condition: New. pp. 568.
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US$ 388.66
US$ 56.86 shipping
Ships from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. M. Datta, Tetsuya Osaka, J. Walter SchultzeMicroelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the.
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Microelectronic Packaging
Language: English
Published by Taylor & Francis Group, 2004
ISBN 10: 041531190X ISBN 13: 9780415311908
Condition: New. pp. 568.
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Microelectronic Packaging
Language: English
Published by Taylor & Francis Ltd Dez 2004, 2004
ISBN 10: 041531190X ISBN 13: 9780415311908
Buch. Condition: Neu. Neuware - Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, then discusses chip metallization topics. It explores key aspects of chip-package interconnect technologies, and analyzes packages, boards, and connectors. It concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.
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Microelectronic Packaging
Language: English
Published by Taylor & Francis Group, 2004
ISBN 10: 041531190X ISBN 13: 9780415311908
US$ 397.22
US$ 8.71 shipping
Ships from United Kingdom to U.S.A.Quantity: 3 available
Add to basketCondition: New. pp. 568 Illus. This item is printed on demand.
