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9780442010584 - Thermal Stress and Strain in Microelectronics Packaging (5 results)
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hardcover. Condition: Good.
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Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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hardcover. Condition: As New.
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Hardcover. Condition: Good. Good condition with wear and marking.
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Condition: new.
