Isbn: 9780444425607 - Micromachining and Micropackaging of Transducers (studies in Electrical and Electronic Engineering) (2 results)
Micromachining and Micropackaging of Transducers (Studies in Electrical and Electronic Engineering)
C. D. Fung And Peter W. Cheung And Wen H. Ko And David G. Fleming
- Hardcover
Seller: David's Books, ypsilanti, MI, U.S.A.David's Books
Contact seller2-star sellerCondition: Used - Fair
US$ 39.50
US$ 5.35 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Fair. Dust Jacket Condition: No Dust Jacket As Issued. Library pocket and spine tape, cover nicked top of spine ; Ex-Library.
Micromachining and Micropackaging of Transducers (STUDIES IN ELECTRICAL AND ELECTRONIC ENGINEERING)
Fung, C. D.; Cheung, Peter W.; Ko, Wen H.; Fleming, David G.
- Hardcover
Seller: -OnTimeBooks-, Phoenix, AZ, U.S.A.-OnTimeBooks-
Contact seller5-star sellerCondition: Used - Good
US$ 66.53
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…
