9781032881140 - Practical Guide for the Reliable Packaging of Electronics by Jamnia, Ali (16 results)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. 4th edition NO-PA16APR2015-KAP.
- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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- Hardcover
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 4th edition. 352 pages. 9.18x6.12x9.45 inches. In Stock.
- Hardcover
- Print on Demand
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
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Hardcover. Condition: new. Hardcover. A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insi…ghts into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs. The fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Hardcover
- Print on Demand
Seller: CitiRetail, Stevenage, United KingdomCitiRetail
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Hardcover. Condition: new. Hardcover. A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insi…ghts into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs. The fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
- Hardcover
- Print on Demand
Seller: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contact seller5-star sellerCondition: New
US$ 288.53
US$ 37.00 shippingShips from Australia to U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insi…ghts into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs. The fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
