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9783319832098 - Materials for Advanced Packaging (11 results)
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Materials for Advanced Packaging
Seller: Books From California, Simi Valley, CA, U.S.A.
Seller rating 5 out of 5 stars
paperback. Condition: Very Good.
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Condition: New. pp. 985.
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US$ 229.27
Convert currencyUS$ 11.53 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketCondition: New. pp. 985.
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Materials for Advanced Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 233.11
Convert currencyUS$ 15.91 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
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Materials for Advanced Packaging
Published by Springer International Publishing, Springer Nature Switzerland, 2018
ISBN 10: 3319832093 ISBN 13: 9783319832098
Language: English
US$ 280.99
Convert currencyUS$ 40.92 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
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Materials for Advanced Packaging
Published by Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
ISBN 10: 3319832093 ISBN 13: 9783319832098
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
US$ 280.99
Convert currencyUS$ 63.74 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketTaschenbuch. Condition: Neu. Neuware -This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 988 pp. Englisch.
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US$ 210.09
Convert currencyUS$ 8.63 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: New. pp. 985 This item is printed on demand.
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Materials for Advanced Packaging
Published by Springer International Publishing, 2018
ISBN 10: 3319832093 ISBN 13: 9783319832098
Language: English
US$ 229.92
Convert currencyUS$ 56.78 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive summary of the most recent advances in materials development for advanced packagingCovers emerging technologies such as digital health, bio-medical and nano materials and process, and microelectronic and optoelectronic pac.
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Materials for Advanced Packaging
Published by Springer International Publishing, Springer International Publishing Jun 2018, 2018
ISBN 10: 3319832093 ISBN 13: 9783319832098
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
US$ 280.99
Convert currencyUS$ 26.66 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketTaschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering. 988 pp. Englisch.
