Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: booksXpress, Bayonne, NJ, U.S.A.
Soft Cover. Condition: new.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: New.
Published by Springer 3/7/2012, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: BargainBookStores, Grand Rapids, MI, U.S.A.
Paperback or Softback. Condition: New. Surface Mount Technology: Principles and Practice 1.86. Book.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
Condition: New.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Springer Netherlands Mrz 2012, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology. 640 pp. Englisch.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: GreatBookPricesUK, Castle Donington, DERBY, United Kingdom
Condition: New.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Condition: New. Num Pages: 634 pages, biography. BIC Classification: TDP. Category: (G) General (US: Trade). Dimension: 229 x 152 x 33. Weight in Grams: 924. . 2012. Softcover reprint of the original 1st ed. 1989. Paperback. . . . .
Published by Springer Netherlands, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New. Num Pages: 634 pages, biography. BIC Classification: TDP. Category: (G) General (US: Trade). Dimension: 229 x 152 x 33. Weight in Grams: 924. . 2012. Softcover reprint of the original 1st ed. 1989. Paperback. . . . . Books ship from the US and Ireland.
Published by Springer 2012-03, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: Chiron Media, Wallingford, United Kingdom
PF. Condition: New.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: As New. Unread book in perfect condition.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: GreatBookPricesUK, Castle Donington, DERBY, United Kingdom
Condition: As New. Unread book in perfect condition.
Published by Springer, 2012
ISBN 10: 9401165343 ISBN 13: 9789401165341
Seller: Mispah books, Redhill, SURRE, United Kingdom
Paperback. Condition: Like New. Like New. book.