Advanced Manufacturing Techniques Engineering (80 results)

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Softcover. Condition: gut. 1989. Non-Destructive Testing (NDT) is an activity closely related to the quality and reliability of products, and to the reliable and safe operation of industrial plants. Physical measuring techniques are used to examine parts of constructional assemblies for hidden imperfections and defects. A wide choice of measuring techniques is available to meet the demand of examining a wide variety of materials such as metals, plastics, rocks, as well as different structures and sizes ranging from semiconductor chips to nuclear reactors and off-shore oil platforms. Activities in the field of NDT encompass: Fundamental research to understand and describe the way in which reactions of certain imperfections to a physical measuring technique can be optimized and used to assess type and grade of imperfection; Methods to characterize materials and materials properties; Applications in product quality control; Applications in plant inspection to ensure a reliable operation of components, avoiding damage to both man and environment, as well as financial losses; Personnel education and qualification schemes; The spread of NDT applications to newly industrialized countries.Content: Inhalt Band 2 (Kapitel 5 bis 7): 5. Applications of NDT 5.1 Applications in steel industry 5.2 Applications in chemical and petrochemical process industry 5.3 Applications in nuclear and electricity industry 5.4 Applications in off-shore 5.5 Applications in aerospace 5.6 Applications in civil works 5.6.1. Applications in civil engineering 5.6.2. NDT of civil works 5.7 NDT and manufacturing 5.7.1. Product quality 5.7.2. Instrumentation and techniques tor product and quality control 5.7.3. Inspection in manufacturing 5.7.4. NDT aspects at manufacturing 5.8 Materials research 5.8.1. NDT and materials research 5.8.2. Materials research ca steels (UT and AE techniques) 5.83. Materials research on steels (electro magnetical techniques) 5.8.4. Materials research on steels (various techniques) 5.8.5. Inspection of advanced materials, composites, bonded structures 5.8.6. NDT of concrete 5.8.7. Applications of NDT on composites and advanced materials 5.8.8. Composites and advanced materials (NDT techniques/ instrumental ion) 5.9 Trends in NDT 6. Fitness for purpose 6.1 Characterization of discontinuities 6.2 Reliability of NDT 6.3 Life-time assessment 7. Training and standards 7.1 Personnel education and training schemes 7.2 Education and training 7.3 Certification and qualification 7.4 NDT standards development 7.5 Equipment qualification standards 7.6 NDT in developing countries Non-Destructive Testing: International Conference Proceedings EAN (ISBN-13): 9780444874504 ISBN (ISBN-10): 044487450X Erscheinungsjahr: 1989 Herausgeber: North Holland ISBN/EAN: 044487450X ISBN: 0-444-87450-X, 978-0-444-87450-4 Autor des Buches: boogaard, test, proceedings, conference, van, dijk, boogard, the world Non-Destructive Testing: Proceedings of the 12th World Conference on Non-Destructive Testing Non-Destructive Testing: Proceedings of the 12th World Conference on Non-Destructive Testing Boogaard, J. WORLD CONFERENCE ON NON-DESTRUCTIVE TEST, Dijk, G. M. Van Amsterdam, the Netherlands, April 23-28, 1989, Volume 2 In englischer Sprache. pages.…

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Taschenbuch. Condition: Neu. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method | Seonho Seok | Taschenbuch | Springer Series in Advanced Manufacturing | viii | Englisch | 2019 | Springer | EAN 9783030085612 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.…

Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.…

Condition: New. Softcover reprint of the original 1st ed. 2018 edition NO-PA16APR2015-KAP.

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