Advanced Nanoelectronics (106 results)
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 63.15
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Condition: New. pp. 204.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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- Hardcover
Seller: Anybook.com, Lincoln, United KingdomAnybook.com
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US$ 48.97
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Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,3000grams, ISBN:9783527403639.
- Hardcover
Seller: Anybook.com, Lincoln, United KingdomAnybook.com
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US$ 48.87
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Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,3000grams, ISBN:9783527403639.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 72.24
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- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: medimops, Berlin, Germanymedimops
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US$ 56.35
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Condition: very good. Gut/Very good: Buch bzw. Schutzumschlag mit wenigen Gebrauchsspuren an Einband, Schutzumschlag oder Seiten. / Describes a book or dust jacket that does show some signs of wear on either the binding, dust jacket or pages.
- Hardcover
Seller: SMASS Sellers, IRVING, TX, U.S.A.SMASS Sellers
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- Hardcover
Seller: Antiquariat Bookfarm, Löbnitz, GermanyAntiquariat Bookfarm
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US$ 47.40
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Hardcover. Condition: Gut. 590 S. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. 030643881X Sprache: Englisch Gewicht in Gramm: 550.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 83.33
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- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 91.95
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- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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perfect. Condition: New.
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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US$ 110.17
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- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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US$ 110.56
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- Softcover
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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US$ 114.48
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Condition: new.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 123.10
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Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Condition: New.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 128.21
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Condition: New. 2nd edition NO-PA16APR2015-KAP.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 66.55
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-…values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
