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Bond Graph Modelling Engineering (28 results)
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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US$ 47.73 10% off
US$ 42.96
US$ 19.35 shipping
Ships from France to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: Bon. Ancien livre de bibliothèque avec équipements. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Good. Former library book. Ammareal gives back up to 15% of this item's net price to charity organizations.
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Hardback or Cased Book. Condition: New. Modelling and Simulation in Thermal and Chemical Engineering: A Bond Graph Approach. Book.
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Condition: As New. Unread book in perfect condition.
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Condition: As New. Unread book in perfect condition.
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Modelling and Simulation in Thermal and Chemical Engineering: A Bond Graph Approach
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 70.54
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Modelling and Simulation in Thermal and Chemical Engineering: A Bond Graph Approach
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 70.54
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US$ 66.68
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Modelling and Simulation in Thermal and Chemical Engineering : A Bond Graph Approach
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 70.15
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Modelling and Simulation in Thermal and Chemical Engineering : A Bond Graph Approach
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 70.53
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Modelling and Simulation in Thermal and Chemical Engineering : A Bond Graph Approach
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 78.17
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Modelling and Simulation in Thermal and Chemical Engineering : A Bond Graph Approach
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 78.20
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Modelling and Simulation in Thermal and Chemical Engineering : A Bond Graph Approach
Language: English
Published by Springer Berlin Heidelberg, 2010
ISBN 10: 3642085660 ISBN 13: 9783642085666
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - It is a great pleasure for me to introduce this book which has the main ambition to make thermodynamics more directly accessible to engineers and physicists by stressing the analogies with the other physical domains; this science has discouraged more than a few students. The book comes from the meeting of two persons: 1. Jean Thoma, inventor of hydrostatic machines and transmissions, pro fessor at the University of Waterloo (Canada), expert in simulation and pilgrim for the promotion of bond graphs around the world. 2. Belkacem Ould Bouamama, associated professor at the University of Science and Technology in Lille, France, specialist in industrial control and seduced by the richness and structure of the bond graph method. Thermodynamics is a difficult subject; its concepts like entropy, enthalpy, etc. are not intuitive and often very abstract. For this reason, it is current practice to neglect the thermal aspects, although they are necessarily there in all physical phenomena, and to use isothermal models. This is equivalent to think that the system is immersed in an infinite temperature reservoir and maintains its temperature constant even if it receives or dissipates electric and other type of energy. For heat transfer and variable temperature, if it should be included, the classical approach is to study the changes between equilibrium states, and not the process itself, which is more a thermostatic than a thermodynamic approach. This is justified when only the constraints of equilibrium state must be satisfied.
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Modelling and Simulation in Thermal and Chemical Engineering | A Bond Graph Approach
Language: English
Published by Springer-Verlag GmbH, 2010
ISBN 10: 3642085660 ISBN 13: 9783642085666
Taschenbuch. Condition: Neu. Modelling and Simulation in Thermal and Chemical Engineering | A Bond Graph Approach | B. Ould Bouamama (u. a.) | Taschenbuch | xiv | Englisch | 2010 | Springer-Verlag GmbH | EAN 9783642085666 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Modelling and Simulation in Thermal and Chemical Engineering : A Bond Graph Approach
Language: English
Published by Springer, Berlin, Springer Berlin Heidelberg, Springer, 1999
ISBN 10: 3540663886 ISBN 13: 9783540663881
Buch. Condition: Neu. Neuware - It is a great pleasure for me to introduce this book which has the main ambition to make thermodynamics more directly accessible to engineers and physicists by stressing the analogies with the other physical domains; this science has discouraged more than a few students. The book comes from the meeting of two persons: 1. Jean Thoma, inventor of hydrostatic machines and transmissions, pro fessor at the University of Waterloo (Canada), expert in simulation and pilgrim for the promotion of bond graphs around the world. 2. Belkacem Ould Bouamama, associated professor at the University of Science and Technology in Lille, France, specialist in industrial control and seduced by the richness and structure of the bond graph method. Thermodynamics is a difficult subject; its concepts like entropy, enthalpy, etc. are not intuitive and often very abstract. For this reason, it is current practice to neglect the thermal aspects, although they are necessarily there in all physical phenomena, and to use isothermal models. This is equivalent to think that the system is immersed in an infinite temperature reservoir and maintains its temperature constant even if it receives or dissipates electric and other type of energy. For heat transfer and variable temperature, if it should be included, the classical approach is to study the changes between equilibrium states, and not the process itself, which is more a thermostatic than a thermodynamic approach. This is justified when only the constraints of equilibrium state must be satisfied.
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Modelling and Simulation in Thermal and Chemical Engineering : A Bond Graph Approach
Language: English
Published by Springer-Verlag GmbH, 1999
ISBN 10: 3540663886 ISBN 13: 9783540663881
Condition: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Bond Graph Modelling of Engineering Systems: Theory, Applications and Software Support
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 191.35
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Hardcover. Condition: Neu. Neu Neuware, auf Lager - The author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling. It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields. This presentation of advanced work in bond graph modeling presents the leading edge of research in this field. It is hoped that it stimulates new ideas with regard to further progress in theory and in applications.
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Condition: New. pp. 452.
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US$ 293.76
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Add to basketHardcover. Condition: Like New. Like New. book.
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Bond Graph Modelling of Engineering Systems
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 4 out of 5 stars
US$ 195.15
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Add to basketHRD. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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HRD. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Bond Graph Modelling of Engineering Systems: Theory, Applications and Software Support
Language: English
Published by SPRINGER NATURE Jun 2011, 2011
ISBN 10: 1441993673 ISBN 13: 9781441993670
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling. It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields. This presentation of advanced work in bond graph modeling presents the leading edge of research in this field. It is hoped that it stimulates new ideas with regard to further progress in theory and in applications. 435 pp. Englisch.
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US$ 320.19
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Ships from United Kingdom to U.S.A.Quantity: 4 available
Add to basketCondition: New. Print on Demand pp. 452 Illus.
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Condition: New. PRINT ON DEMAND pp. 452.
